#I m using a bunch of nRF24L01s for my
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Be sure to have enough bypass capacitance on the power to the nRF24L01 modules, this made all the difference when I work with the nRF24L01s
Thanks! I did not know about that! Is the usual .1 ufd close to the module sufficient, or do you also suggest some higher values like 470 ufd in parallel?
This also suggests that I'd get worse results with a solderless breadboard vs. a good layout on a PCB. Do you think a ground plane is necessary? I'm milling single sided PCBs on a Bantam PCB mill and I haven't tried dual sided yet.
Another thing is to decrease the spi clock speed. It can run at a maximum of 10MHz, and at that frequency, tiny capacitances and inductances between wires mess things up. The modules are very finicky. This is from an electronoobs video.
See the video for the code to reduce the spi clock speed. You also want to reduce interference from other buses near the spi lines.
I got nrf24l01s to work on breadboards before, but that was with some very good wiring and bypass caps on everything. Breadboards will probably work really well if you decrease the spi clock speed.
Thanks @nimble harness . I'll add reducing SPI clock speed to my list of things to try. I've laid out a simple board (shield really) which includes a bypass capacitor near the module which I hope will increase reliability.
I just soldered a bypass cap (100uF) on the pins of my NRF24l01s directly.
You might also want to add a ceramic capacitor (0.1uF) in parallel to the larger electrolytic.
Agreed; low value ceramic for high frequency, high value electrolytic for slower changes. How do you feel about tantalum in place of ceramic? Thanks much!
I think tantalum are good, but I've never really used them. My design practice seems to be just stuff a whole bunch of caps on it and hope it works. But I'm not an EE.